Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module
Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module
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DOI：
10.1109/access.2023.3342689
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发表时间：
2024
期刊：
影响因子：
3.9
通讯作者：
P. Rajaguru;T. Tilford;Chris Bailey;S. Stoyanov
中科院分区：
文献类型：
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作者：
P. Rajaguru;T. Tilford;Chris Bailey;S. Stoyanov
提出了一种基于损伤力学的电力电子模块（PEM）引线键合结构损伤演化预测的数值方法。在内部有限元代码中开发了一个简单的损伤演化模型，演示重点是分析PEM在不同热载荷下热致应力引起的引线键合损伤演化。所提出的方法的新奇是在数值方法中PEM结构的有限元模型的每个离散网格单元的水平上实现的损伤演化以及损伤对该单元的机械材料性能的相关影响。一个简化的PEM结构被用作一个案例研究，以证明拟议的损伤演化模型。PEM结构的每个离散化元件的热载荷从外部热代码导入。从热致应力，塑性应变率近似，然后，使用这些指标的损伤演化度量。在案例研究中的引线键合结构的损伤分布图的施加的负载表明，最大的损伤累积在脚跟结构达到总损伤的2.4%后，3秒。通过外推键合损伤演化趋势线，预测了结构失效的时间。在母线上观察到最大von Mises应力，其达到64 MPa。在母线处发现的极端应力归因于母线材料的热膨胀系数的高值。
A damage mechanics-based numerical approach for the prediction of the damage evolution in wirebond structures of the power electronic module (PEM) is presented. A simplistic damage evolution model is developed in an in-house finite element code, with a demonstration focused on the analysis of the wirebond damage evolution by thermally induced stresses in PEM subjected to varying thermal loads. The novelty of the proposed methodology is the damage evolution realized at the level of each discretised mesh element of the finite element model of the PEM structure in the numerical approach and the associated impact of damage on the mechanical material properties of that element. A simplified PEM structure is utilised as a case study to demonstrate the proposed damage evolution modelling. The thermal load of each discretised element of the PEM structure was imported from an external thermal code. From the thermally induced stresses, plastic strain rates were approximated and then, using these metrics a damage evolution metric was derived. The damage distribution plot of the wirebond structure for the applied load in the case study indicates that maximum damage accumulation at the heel structure reaches 2.4% of the total damage after 3 seconds. By extrapolating the trendline of damage evolution in wirebond, the time of the structural failure was also predicted. The maximum von Mises stress was observed on the busbar which reaches 64 MPa. The extreme stresses found at the busbar are attributed to the high value of the coefficient of thermal expansion of the busbar material.