Enhanced oxidation resistance of magnesium nanorods grown by glancing angle deposition

Enhanced oxidation resistance of magnesium nanorods grown by glancing angle deposition
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DOI:
10.1016/j.ijhydene.2011.01.152
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发表时间:
2011-05-01
影响因子:
7.2
通讯作者:
Karabacak, Tansel
Karabacak, Tansel
中科院分区:
工程技术2区
文献类型:
--
作者:
Bayca, Salih U.;Cansizoglu, Mehmet F.;Karabacak, Tansel

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采用热重分析法研究了镁薄膜和镁纳米棒在25-550 ℃温度范围内的氧化行为。垂直镁纳米棒阵列的直流磁控溅射掠射角沉积技术,而镁薄膜的沉积使用相同的系统,但在垂直入射。采用扫描电镜、透射电镜和X射线衍射分析了样品的形貌和晶体结构。我们报告,镁薄膜显示氧化诱导的重量增加从室温开始。另一方面,Mg纳米棒在低于350摄氏度的温度下没有显示出任何显著氧化的迹象。增强的抗氧化性镁纳米棒也证实了石英晶体微天平测量。在高于350摄氏度的温度下,Mg纳米棒开始被氧化,并且它们的重量以与Mg薄膜相似的速率增加。我们认为,镁纳米棒的氧化减少主要归因于它们的单晶性质。镁纳米棒的减少氧化可以潜在地在氢存储和气体传感应用中发挥关键作用。版权所有(C)2011,氢能出版物,LLC。由爱思唯尔有限公司出版。保留所有权利。
Oxidation behavior of magnesium thin films and nanorods were investigated in the temperature range of 25-550 degrees C by using thermal gravimetric analysis. Arrays of vertical magnesium nanorods were deposited by the DC magnetron sputtering glancing angle deposition technique, while the magnesium thin films were deposited using the same system but at normal incidence. The morphologies and corresponding crystal structure of the samples were analyzed by scanning electron microscopy, transmission electron microscopy and X-ray diffraction methods, respectively. We report that the Mg thin films showed oxidation induced weight gain starting from room temperature. On the other hand, Mg nanorods did not show any indication of significant oxidation at temperatures below 350 degrees C. Enhanced oxidation resistance of Mg nanorods was also confirmed by quartz crystal microbalance measurements. At temperatures higher than 350 degrees C, Mg nanorods started to get oxidized and their weight increased at a similar rate to that of Mg thin films. We argue that reduced oxidation of Mg nanorods is mainly attributed to their single crystal nature. Magnesium nanorods' reduced oxidation can potentially play a key role in hydrogen storage and gas sensing applications.Copyright (C) 2011, Hydrogen Energy Publications, LLC. Published by Elsevier Ltd. All rights reserved.