Dismantlable Adhesion Interface Featuring a Thermo/Photocleavable Molecular Layer
Dismantlable Adhesion Interface Featuring a Thermo/Photocleavable Molecular Layer
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DOI：
10.1002/adem.202100823
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发表时间：
2021-09-13
影响因子：
3.6
通讯作者：
Matsuzawa, Yoko
中科院分区：
文献类型：
--
作者：
Aizawa, Miho;Akiyama, Haruhisa;Matsuzawa, Yoko
可拆卸粘合系统在工业应用中变得越来越重要，因为它们促进了一系列材料的回收。许多可拆卸的粘合剂已被开发，以响应这一需求;然而，它们的拆卸机制仅限于那些利用散装状态的变化。在此，提出了一种新的拆卸粘合系统，其能够基于共价键的变化来降低粘合强度。这通过使用包含蒽光二聚体的热和光可裂解分子层来实现。基于基材和粘合剂之间形成的共价键，在粘合界面处施加的分子层表现出两倍于未涂覆基材的粘合强度。加热粘附的试样1分钟，成功地降低了60%的剥离强度，并诱导拆除的分子层。此外，可以通过利用光照射的低能量光裂解过程来拆除粘合接头。该过程所需的能量低于其他光触发可固化粘合剂的10%。所提出的系统提供了新的见解，可拆卸的粘附技术的发展，利用在界面处的粘附机制。
Dismantlable adhesion systems are becoming increasingly important in industrial applications, as they facilitate the recycling of a range of materials. Many dismantlable adhesives have been developed in response to this demand; however, their dismantling mechanisms are limited to those that utilize changes in bulk state. Herein, a novel dismantling adhesion system that enables the adhesion strength to be reduced based on covalent bond change is proposed. This is achieved by using a thermo- and photocleavable molecular layer comprising an anthracene photodimer. The molecular layer applied at the adhesion interface exhibits an adhesion strength twice that of the uncoated substrate, based on the formation of covalent bonds between the substrates and adhesives. Heating the adhered specimen for 1 min successfully reduces the peel strength by 60% and induces dismantling at the molecular layer. Furthermore, it is possible to dismantle adhesive joint through a low-energy photocleavage process with light irradiation. This process requires under 10% of the energy of other light-triggered dismantlable adhesives. The proposed system provides new insights for the development of dismantlable adhesion technology, leveraging the adhesion mechanism at the interface.