Solution-processed polycrystalline silicon on paper
Solution-processed polycrystalline silicon on paper
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DOI：
10.1063/1.4916998
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发表时间：
2015-04-20
影响因子：
4
通讯作者：
Ishihara, R.
中科院分区：
文献类型：
--
作者：
Trifunovic, M.;Shimoda, T.;Ishihara, R.
印刷电子学带来了以前传统电子工艺无法实现的应用领域。溶液在室温下用作大面积的油墨，允许生产完全柔性的电路。通常，由于有机和金属氧化物油墨材料的可印刷性，对这些油墨的研究主要集中在有机和金属氧化物油墨材料上，而与硅电子材料相比，这些材料缺乏电子性能。另一方面，硅电子学直到最近才在溶液工艺中找到了自己的出路。以环戊硅烷为硅油墨进行了印刷，并制成了与其他油墨材料相比电性能优越得多的器件。然而，这种材料的热退火步骤是必要的，这阻碍了它在有限热预算的廉价基板上的使用。在这项工作中，我们介绍了一种方法，允许使用准分子激光照射从相同的液态硅墨水直接生产多晶硅（poly-Si）。通过这种方法，即使只有一个激光脉冲，也可以直接在纸上形成多晶硅。使用这种方法，多晶硅晶体管的最高温度仅为150摄氏度。这种方法允许在廉价，温度敏感的衬底（如聚对苯二甲酸乙二醇酯，聚萘二甲酸乙二醇酯或纸）上形成硅器件，从而导致需要低成本但高速电子产品的应用。(C) 2015 AIP出版有限责任公司
Printing electronics has led to application areas which were formerly impossible with conventional electronic processes. Solutions are used as inks on top of large areas at room temperatures, allowing the production of fully flexible circuitry. Commonly, research in these inks have focused on organic and metal-oxide ink materials due to their printability, while these materials lack in the electronic performance when compared to silicon electronics. Silicon electronics, on the other hand, has only recently found their way in solution processes. Printing of cyclopentasilane as the silicon ink has been conducted and devices with far superior electric performance have been made when compared to other ink materials. A thermal annealing step of this material, however, was necessary, which prevented its usage on inexpensive substrates with a limited thermal budget. In this work, we introduce a method that allows polycrystalline silicon (poly-Si) production directly from the same liquid silicon ink using excimer laser irradiation. In this way, poly-Si could be formed directly on top of paper even with a single laser pulse. Using this method, poly-Si transistors were created at a maximum temperature of only 150 degrees C. This method allows silicon device formation on inexpensive, temperature sensitive substrates such as polyethylene terephthalate, polyethylene naphthalate or paper, which leads to applications that require low-cost but high-speed electronics. (C) 2015 AIP Publishing LLC.