Nanocrystalline Ni-Cu alloy plating by pulse electrolysis
Nanocrystalline Ni-Cu alloy plating by pulse electrolysis
复制标题
DOI：
10.1016/s0257-8972(00)00520-x
复制
发表时间：
2000-04-03
影响因子：
5.4
通讯作者：
Totlani, MK
中科院分区：
文献类型：
--
作者：
Ghosh, SK;Grover, AK;Totlani, MK
研究了脉冲电解工艺以及脉冲参数对柠檬酸盐镀液沉积镍铜合金成分的影响。通过对脉冲时间、弛豫时间和峰值电流密度的精确控制，获得了均匀、光滑、光亮的镀层。搅拌、高pH和高温显示出增加了存款的铜含量。X射线衍射、扫描电子显微镜（SEM）和透射电子显微镜（TEM）研究表明，沉积的Ni-Cu合金本质上是纳米晶（微晶尺寸类似于2.5-28.5 nm），并且以单一FCC相存在。应变和平均晶粒尺寸也已估计从X-射线衍射线展宽分析。脉冲电流（PC）电镀样品的努普显微硬度高于直流（DC）电镀样品，而PC样品的内应力较低。脉冲电镀Ni-35.8wt.%的耐蚀性铜合金，通过动电位极化研究评价，在脱气3重量%在50 ℃的NaCl溶液中，优于直流电镀合金和商业Monel-400。(C)2000 Elsevier Science S.A. All rights reserved.
Pulse electrolysis and the effect of pulse parameters on the composition of Ni-Cu alloys deposited from a citrate bath has been studied. Coherent, smooth and bright coating is obtained by precise control of the pulse time, relaxation time and peak current density. Stirring, high pH and high temperature is shown to increase the copper content of the deposit. X-Ray diffraction, scanning electron microscopy (SEM) and transmission electron microscopy (TEM) studies revealed that the deposited Ni-Cu alloy is nanocrystalline in nature (crystallite size similar to 2.5-28.5 nm) and it exists in a single FCC-phase. The strain and mean crystallite size has also been estimated from X-ray diffraction line broadening analysis. Knoop microhardness for pulse current (PC) plated samples is higher than the direct current (DC) plated sample and the internal stress is lower for the PC sample. The corrosion resistance of the pulse-plated Ni-35.8 wt.% Cu alloy, as evaluated by potentiodynamic polarisation studies in deaerated 3 wt.% NaCl solution at 50 degrees C, is better than that of the DC-plated alloy and the commercial Monel-400. (C) 2000 Elsevier Science S.A. All rights reserved.