Advanced interconnect equipment and process development
Advanced interconnect equipment and process development
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先进互连设备和工艺开发
DOI：
10.1109/eptc.2014.7028343
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发表时间：
2014
期刊：
影响因子：
--
通讯作者：
C. Luechinger
中科院分区：
文献类型：
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作者：
Tao Xu;Todd Walker;Raymond P. S. Chen;Jason Fu;C. Luechinger
随着功率模块和汽车行业对更高可靠性的需求增加，铝基互连正成为模块性能的瓶颈之一，并有可能被铜基先进互连所取代。本文列出了在替代真正发生之前必须克服的挑战，并介绍了K&S正在努力克服这些挑战的解决方案。我们正在开发一个包括设备、焊接头、耗材和焊接工艺的整体解决方案，并提供给客户进行评估。开发了具有关键功能的可配置键合头，以实现先进的互连开发，提供足够的超声功率、键合力和切割系统刚度。它可以在一个小时内轻松重新配置，在3种配置中，以测试不同的粘合材料和封装平台。为了提高耗材寿命，开发了一种与铜（Cu）线具有更好耦合的脊形焊接工具（K&S专利设计）和一种由耐磨材料制成的切割刀片，并证明其具有> 100，000次焊接寿命。铜基连接材料的连接机理复杂，与铝基材料有很大的不同。提出了一种多相键合曲线，并开发了多段键合程序，以使键合过程中的每个阶段的参数优化，以实现更好的键合质量。在我们的实验室中展示了> 100，000个键的稳定过程。
With increased demand for higher reliability in power modules and the automotive industry, aluminum-based interconnects are becoming one of the bottlenecks in module performance and will potentially be replaced by copper-based advanced interconnects. This paper lists the challenges that have to be overcome before the replacement can really happen, and introduces solutions that K&S is working on to overcome those challenges. An overall solution consisting of equipment, bond heads, consumables, and bonding processes is being developed and provided to customers for evaluation. A configurable bond head with critical features was developed to enable the advanced interconnect development, providing enough ultrasonic power, bond force, and cutting system rigidity. It can be easily reconfigured within an hour, among 3 configurations, to test different bonding materials and packaging platforms. To improve consumable lifetime, a ridged bond tool (a K&S patented design), that has better coupling to copper (Cu) wire, and a cutter blade, made of wearable material, were developed and demonstrated to have a >100,000 bond life time. The bonding mechanism for Cu-based bonding materials is sophisticated and very different from that of Al-based materials. A multi-phase bond profile was proposed and a multi-segmented bonding program was developed to enable parameter optimization at each stage of the bonding process to achieve a better bond quality. A stable process of >100,000 bonds was demonstrated in our lab.