Analytical solution for filmwise condensation in confined high-aspect ratio geometry

Analytical solution for filmwise condensation in confined high-aspect ratio geometry
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受限高纵横比几何结构中薄膜冷凝的解析解

DOI:
10.1016/j.ijheatmasstransfer.2018.12.131
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发表时间:
2019
影响因子:
5.2
通讯作者:
Grigoriev, Roman O.
Grigoriev, Roman O.
中科院分区:
工程技术2区
文献类型:
--
作者:
Liu, Jia;Grigoriev, Roman O.

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本研究通过构建和求解一个综合的传输模型,描述了通过气相,界面和冷凝膜的热阻,并通过冷却壁的热传导在自洽的方式通过热和质量传输的自由蒸汽冷凝的问题。我们已经表明,它是可能的,以获得一个解析解的模型,描述了在存在任意数量的不可压缩的净冷凝通量。该解表明,只有在气体层热阻无限大的极限下,总热阻才可归结为壁面热阻、冷凝液膜热阻、界面热阻和气体层扩散热阻之和,但一般形式更为复杂。最后,我们推导出了冷凝膜厚度分布的解析解,它推广了Nusselt的经典自由冷凝解。两个有限的导热系数的壁和热毛细应力被证明发挥了重要作用,大大改变了厚度分布。
This study revisits the problem of free vapor condensation in the filmwise regime by constructing and solving a comprehensive transport model that describes heat and mass transport through the gas phase, interfacial and thermal resistance of the condensate film, and heat conduction through the cooled wall in a self-consistent manner. We have shown that it is possible to obtain an analytical solution of the model which describes the net condensation flux in the presence of an arbitrary amount of noncondensables. This solution demonstrates that the overall thermal resistance reduces to a sum of the thermal resistances of the wall, the condensate film, the interfacial resistance, and the diffusive resistance of the gas layer only in the limit of infinite thermal resistance of the gas layer, but generally has a more complicated form. Finally, we derived an analytical solution for the condensate film thickness profile which generalizes Nusselt’s classical free condensation solution. Both finite thermal conductivity of the wall and thermocapillary stresses were shown to play an important role, substantially altering the thickness profile.
DOI: 10.1115/1.3688714
发表时间: 1964-08
影响因子: --
作者:
E. Sparrow;S. Lin
通讯作者: E. Sparrow;S. Lin
DOI: 10.13182/nt92-a34722
发表时间: 1992-09
期刊: Nuclear Technology
影响因子: 1.5
作者:
Y. Kataoka;Tohru Fukui;S. Hatamiya;T. Nakao;M. Naitoh;I. Sumida
通讯作者: Y. Kataoka;Tohru Fukui;S. Hatamiya;T. Nakao;M. Naitoh;I. Sumida