Analysis of a large number of vias and differential signaling in multilayered structures
Analysis of a large number of vias and differential signaling in multilayered structures
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DOI：
10.1109/tmtt.2003.808616
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发表时间：
2003-04
影响因子：
4.3
通讯作者：
Houfei Chen;Qin Li;L. Tsang;Chung-Chi Huang;V. Jandhyala
中科院分区：
文献类型：
--
作者：
Houfei Chen;Qin Li;L. Tsang;Chung-Chi Huang;V. Jandhyala
提出了一种多层电路中垂直通孔的全波建模方法。内部问题的分析是基于磁场绿色函数的柱面波展开。垂直通孔间的多重相互作用由Foldy-Lax散射公式来模拟。通过使用单层组件的级联网络来包括多层效果。利用矩量法分析了通孔和传输线的外问题。外部和内部的问题结合成一个方程组，以方便大量的通孔的解决方案。用这种方法可以计算几千个通孔问题的散射矩阵，而对CPU和内存的要求不高。数值结果已经获得了不同的通孔配置和大范围的频率。还示出了具有周围空闲和短路过孔的差分信号中的共模和差模的结果。
A method is presented for full-wave modeling of vertical vias in multilayered circuits. The analysis of the interior problem is based upon the cylindrical wave expansion of the magnetic field Green's function. The multiple interaction among vertical vias is modeled by the Foldy-Lax scattering formula. Multilayered effects are included by using cascaded network of the single-layer components. The exterior problem of the via and the transmission line is analyzed using the method of moments approach. The exterior and interior problems are combined into a system of equations to facilitate the solution of a large number of vias. Using this approach, the scattering matrix of problems of several thousand vias can be calculated with moderate CPU and memory requirement. Numerical results have been obtained for different via configurations and for a large range of frequency. Also illustrated are results for common and differential mode in differential signaling with surrounding idle and shorting vias.