On the Stress Measurement Method Using Slip Lines in Copper Foil with Grown Grain Structure : Solid-Mechanics, Strength of Materials
On the Stress Measurement Method Using Slip Lines in Copper Foil with Grown Grain Structure : Solid-Mechanics, Strength of Materials
复制标题
利用生长晶粒结构铜箔中滑移线的应力测量方法：固体力学、材料强度
DOI：
10.1299/jsme1987.30.1724
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发表时间：
1987
期刊：
影响因子：
--
通讯作者：
K. Ohshima
中科院分区：
文献类型：
--
作者：
S. Kitaoka;K. Ohshima
本文研究了通过观察生长晶粒结构铜箔中的滑移线来测量机械零件循环应力的方法。并与电镀铜法和再结晶箔法进行了比较。从易于测量的观点来看，该方法比使用再结晶箔的方法优越上级，并且其应变灵敏度比电镀方法高得多。作为该方法的一个应用，计算了各种形式的带平板圆轴在循环扭转载荷作用下的应力集中系数，其结果与前人的结果吻合较好。
By observing slip lines in a copper foil with grown grain structure, the method of measuring cyclic stresses acting on machine elements is studied. The features and distinction of this method in comparison with the copper electroplating method or the method using a recrystallized foil are examined. This method is superior to the method using a recrystallized foil from the standpoint of ease of measurement, and its strain sensitivity is much higher than that of the electroplating method. As an application of this method, the stress concentration factors in various types of circular shafts with a flat part under cyclic torsion are obtained, with the results showing good agreement with those obtained previously.