Interfacial reactions between Sn―8Zn―3Bi―xAg lead-free solders and Cu substrate
Interfacial reactions between Sn―8Zn―3Bi―xAg lead-free solders and Cu substrate
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DOI：
10.1016/j.jallcom.2009.04.003
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发表时间：
2009-08
影响因子：
6.2
通讯作者：
Lijuan Liu;W. Zhou;Baoling Li;P. Wu
中科院分区：
文献类型：
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作者：
Lijuan Liu;W. Zhou;Baoling Li;P. Wu
研究了在 250°C 下焊接 5 至 60 分钟不同时间的 Sn-8Zn-3Bi-xAg（x=0、0.5 和 1wt.%）无铅焊料合金与铜基板之间界面处金属间化合物（IMC）的形成和生长。结果发现，当焊料中添加Ag时，Cu5Zn8和CuZn5在Sn–8Zn–3Bi/Cu界面处形成，而Cu5Zn8和AgZn3在焊料/Cu界面处形成。不同焊料/Cu系统中IMC层的厚度随着焊接时间的增加而增加。发现IMCs的生长主要受扩散机制控制。此外，IMC层的生长随着焊接过程中Ag含量的增加而减少。
The formation and the growth of the intermetallic compounds (IMCs) at the interface between the Sn–8Zn–3Bi–xAg (x=0, 0.5, and 1wt.%) lead-free solder alloys and Cu substrate soldered at 250°C for different durations from 5 to 60min were investigated. It was found that Cu5Zn8and CuZn5formed at Sn–8Zn–3Bi/Cu interface, and Cu5Zn8and AgZn3formed at the solder/Cu interface when the solder was added with Ag. The thickness of IMC layers in different solder/Cu systems increased with increasing the soldering time. And the growth of the IMCs was found to be mainly controlled by a diffusion mechanism. Additionally, the growth of the IMC layers decreased with increasing content of Ag in the soldering process.