Thermoelastic crack analysis in functionally graded materials and structures by a BEM
Thermoelastic crack analysis in functionally graded materials and structures by a BEM
复制标题
通过边界元法对功能梯度材料和结构进行热弹性裂纹分析
DOI:
10.1111/j.1460-2695.2011.01657.x
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发表时间:
2012-08
影响因子:
3.7
通讯作者:
Gao X. W.
中科院分区:
文献类型:
--
作者:
Zhang C.;Sladek J.;Sladek V.;Gao X. W.
In this paper, transient thermoelastic crack analysis in two-dimensional, isotropic, continuously non-homogeneous and linear elastic functionally graded materials subjected to a thermal shock is presented. The Laplace transform technique is used to eliminate the time dependence of the governing equations of the linear coupled thermoelasticity. Fundamental solutions for isotropic, homogeneous and linear elastic solids in the Laplace-transformed domain are applied to derive boundary–domain integral equations for the mechanical and thermal fields. The radial integration method is employed to transform the domain integrals into the boundary integrals. A collocation-based boundary element method is implemented for the spatial discretization of the boundary–domain integral equations. The time-dependent numerical solutions are obtained by using Stehfest's inversion algorithm. Numerical results are presented and discussed to show the influences of the material gradation, the thermo-mechanical coupling, the crack orientation and the thermal shock loading on the dynamic stress intensity factors.
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影响因子:
2.9
作者:
Gao, XW
通讯作者:
Gao, XW
影响因子:
4.7
作者:
W. Chang-chun;H. Peixiang;Li Ziran-;Li Ziran-
通讯作者:
W. Chang-chun;H. Peixiang;Li Ziran-;Li Ziran-
DOI:
10.1098/rspa.2001.0952
发表时间:
2002-08
期刊:
Proceedings of the Royal Society of London. Series A: Mathematical, Physical and Engineering Sciences
影响因子:
--
作者:
Paul A. Martin;J. Richardson;Leonard J. Gray;John Berger
通讯作者:
Paul A. Martin;J. Richardson;Leonard J. Gray;John Berger
影响因子:
3.6
作者:
A. A. Cannarozzi-A.;F. Ubertini
通讯作者:
A. A. Cannarozzi-A.;F. Ubertini
DOI:
10.1098/rspa.2003.1220
发表时间:
2004-06
期刊:
Proceedings of the Royal Society of London. Series A: Mathematical, Physical and Engineering Sciences
影响因子:
--
作者:
Youn-Sha Chan;L. Gray;T. Kaplan;G. Paulino
通讯作者:
Youn-Sha Chan;L. Gray;T. Kaplan;G. Paulino