Closed form solutions for partially debonded circular inclusion in piezoelectric materials
Closed form solutions for partially debonded circular inclusion in piezoelectric materials
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DOI：
10.1007/bf01179207
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发表时间：
1999-09
期刊：
影响因子：
2.7
通讯作者：
W. Deng;S. Meguid
中科院分区：
文献类型：
--
作者：
W. Deng;S. Meguid
本文讨论了压电基体中部分脱粘的压电圆形夹杂物的问题。通过使用解析延拓理论，该边值问题被简化为两个黎曼-希尔伯特问题。通过考虑复场势在原点和无穷大处的行为，获得了闭式解。明确推导了界面裂纹电弹性场强度因子的计算公式。提供了几个具体案例来显示裂纹角度、机械和电气性能以及载荷对电弹性场奇点的影响。
This paper deals with the problem of a partially debonded piezoelectric circular inclusion in a piezoelectric matrix. This boundary value problem is reduced to two Riemann-Hilbert problems through the use of the analytical continuation theory.Closed form solutionsare obtained by considering the behavior of the complex field potentials at origin and infinity. The formulae for the electro-elastic field intensity factors of the interfacial crack are derivedexplicitly. Several particular cases are provided to show the effect of the crack angle, the mechanical and electrical properties and the loads on the electroelastic field singularities.