Recent advances in reverse offset printing: an emerging process for high-resolution printed electronics
Recent advances in reverse offset printing: an emerging process for high-resolution printed electronics
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DOI：
10.7567/1347-4065/ab6462
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发表时间：
2020-04-01
影响因子：
1.5
通讯作者：
Ushijima, Hirobumi
中科院分区：
文献类型：
--
作者：
Kusaka, Yasuyuki;Fukuda, Nobuko;Ushijima, Hirobumi
综述了用于印刷电子学的高分辨率印刷技术的机理、材料和工艺。先进的印刷方法，包括反向胶印和附着力对比平版印刷，利用聚二甲基硅氧烷(PDMS)吸收油墨溶剂，在油墨转移之前将油墨半固化。图案化原理从润湿转变为粘合和断裂；可以避免在液体油墨图案化过程中遇到的分辨率问题(例如，展开、分裂、合并、凸起和咖啡环形状)，并可以实现单AM特征。在总结了反向胶印的基本原理后，详细介绍了在反向胶印过程中遇到的图案化机理和接触机理，以及油墨配方的设计概念。介绍了用于多层电子器件的补充工艺(例如，用于高通量生产的湿-湿)、埋电极形成、锥形形成和垂直互连)以及图形尺寸完整性的预测。(C)2020年日本应用物理学会
Mechanisms, materials, and processes of high-resolution printing techniques dedicated to printed electronics are reviewed. Advanced printing methods, including reverse offset printing and adhesion contrast planography, use absorption of ink solvents by polydimethylsiloxane (PDMS) to semi-solidify inks before ink-transfer. The patterning principle transforms from wetting to adhesion and fracture; resolution problems encountered during the patterning of liquid inks (e.g. spreading, splitting, coalescence, bulges, and coffee ring shapes) can be avoided, and single-AM features can be achieved. After summarizing the fundamentals of reverse offset printing, details on the patterning mechanism and contact mechanics encountered during the process are shown together with the design concept of the ink formulation. Complementary processes for multilayered lectronic devices (e.g. wet-on-wet for high-throughput production buried electrode formation taper formation and vertical interconnections) and the prediction of pattern size integrity are presented. (C) 2020 The Japan Society of Applied Physics