Multilayer high density flex technology
Multilayer high density flex technology
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多层高密度柔性技术
DOI：
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发表时间：
1999
期刊：
影响因子：
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通讯作者：
V. Wang
中科院分区：
文献类型：
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作者：
B. Chou;S. Beilin;H. Jiang;D. Kudzuma;M. Lee;M. Mccormack;T. Massingill;M. Peters;J. Roman;Y. Takahashi;V. Wang
缩小微电子器件同时增加互连密度的工业趋势对封装这些器件的衬底提出了很高的要求。多层柔性电路将提供所需的互连密度，以满足广泛的封装和互连技术的这些需求。本文讨论了超高密度柔性电路的发展。研究了制造从12.5 /spl μ/m到40 /spl μ/m的细线间距的工艺和材料。各种微孔结构，通孔和盲孔，演示。一个测试车辆的设计和建造的BGA封装，以说明密度的能力。通过使用Z连接来连接两个层对，展示了四层结构。电气，机械和可靠性测试结果显示的柔性基板材料，Z连接方法和制造工艺的选择。高密度柔性替代基板的成本比较进行了讨论，以确定潜在的。
The industrial trend of shrinking microelectronic devices while increasing the density of interconnections places great demands on the substrates upon which these devices are packaged. Multilayer flex circuits will provide the interconnection densities needed to meet these demands in a wide range of packaging and interconnection technologies. This paper discusses the development of ultra-high density flexible circuits. Processes and materials to fabricate fine line pitches from 12.5 /spl mu/m to 40 /spl mu/m are examined. Various microvia structures, through hole and blind via, are demonstrated. A test vehicle was designed and built for BGA packages to illustrate the density capability. A four-layer structure is demonstrated by using Z-connection to connect two layer pairs. Electrical, mechanical, and reliability test results are presented to show the selection of flex substrate material, Z-connection methodology and fabrication processes. A cost comparison of high-density flex to alternative substrates is discussed to identify potential.