Development of new 2.5D package with novel integrated organic interposer substrate with ultra-fine wiring and high density bumps
Development of new 2.5D package with novel integrated organic interposer substrate with ultra-fine wiring and high density bumps
复制标题
开发新型 2.5D 封装，采用新型集成有机中介层基板，具有超细布线和高密度凸块
DOI：
10.1109/ectc.2014.6897310
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发表时间：
2014
期刊：
影响因子：
--
通讯作者：
Z. Kutlu
中科院分区：
文献类型：
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作者：
K. Oi;Satoshi Otake;N. Shimizu;Shoji Watanabe;Y. Kunimoto;T. Kurihara;Toshinori Koyama;Masato Tanaka;L. Aryasomayajula;Z. Kutlu
随着对小型化和更高密度的需求不断增加，利用硅中介层的 2.5D 封装技术正在开发并用于高性能应用。硅中介层使用标准半导体制造工艺技术实现非常高密度的互连，但随着尺寸的增加而面临挑战。另一种解决方案是高密度层压板中介层，与当今可用的其他中介层选项相比，它在成本、外形尺寸和基础设施方面具有优势。然而，由于传统的构建技术限制了细线和通孔直径，因此很难在层压中介层上制造高密度布线和倒装芯片凸块焊盘。我们的解决方案是将集成有机中介层基板与高密度互连和热压倒装芯片接合相结合。我们的解决方案消除了硅中介层的背面集成工艺以及将中介层组装到基板上的过程。可以利用传统的组装工艺将管芯组装到集成有机中介层基板上。通过将具有 40um 节距铜柱凸块的双芯片组装到这种具有 2μm 线和空间的新型集成有机中介层基板上，证明了这种 2.5D 封装的可行性。
2.5D packaging technology utilizing silicon interposers is being developed and used for high-performance applications as the demand for miniaturization and higher density continues to increase. Silicon interposers enable very high density interconnects using standard semiconductor fabrication process technology, but are challenged as size increases. An alternative solution, high density laminate interposer, can offer advantages in cost, form factor, and infrastructure over other interposer options available today. However, it is difficult to manufacture high density wiring and flip chip bump pads on laminate interposer because conventional build-up technology limits fine line and via diameter. Our solution is the combination of an integrated organic interposer substrate with high density interconnects and thermo-compression flip chip bonding. Our solution eliminates the backside integration process for silicon interposer and assembly of interposers onto substrates. Conventional assembly processes can be utilized for assembling dies onto the integrated organic interposer substrate. Feasibility of this 2.5D package has been demonstrated by assembling dual-die with 40um pitch copper pillar bumps onto this novel integrated organic interposer substrate with 2μm line and space.