300-GHz Step-Profiled Corrugated Horn Antennas Integrated in LTCC
300-GHz Step-Profiled Corrugated Horn Antennas Integrated in LTCC
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DOI：
10.1109/tap.2014.2350520
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发表时间：
2014-11-01
影响因子：
5.7
通讯作者：
Kukutsu, Naoya
中科院分区：
文献类型：
--
作者：
Tajima, Takuro;Song, Ho-Jin;Kukutsu, Naoya
本文提出了300 GHz的阶梯形波纹喇叭天线，针对他们的集成在低温共烧陶瓷（LTCC）封装。采用基片集成波导技术，利用多层LTCC基片内部的谐振腔和周围的通孔栅栏构成馈电空芯波导和喇叭结构。由于垂直配置，我们能够设计喇叭天线的波纹和阶梯状轮廓，以接近光滑的金属表面。为了验证设计实验，LTCC波导和喇叭天线制作与LTCC多层工艺。LTCC波导的插入损耗为0.6 dB/mm，LTCC喇叭天线的峰值增益为18 dBi，带宽为100 GHz，回波损耗超过10 dB。喇叭天线的尺寸仅为5 x 5 x 2.8 mm（3），这使得它很容易集成到LTCC收发器模块中。
This paper presents 300-GHz step-profiled corrugated horn antennas, aiming at their integration in low-temperature co-fired ceramic (LTCC) packages. Using substrate integrated waveguide technology, the cavity inside the multi-layer LTCC substrate and a surrounding via fence are used to form a feeding hollow waveguide and horn structure. Owing to the vertical configuration, we were able to design the corrugations and stepped profile of horn antennas to approximate smooth metallic surface. To verify the design experimentally, the LTCC waveguides and horn antennas were fabricated with an LTCC multi-layer process. The LTCC waveguide exhibits insertion loss of 0.6 dB/mm, and the LTCC horn antenna exhibits 18-dBi peak gain and 100-GHz bandwidth with more than 10-dB return loss. The size of the horn antenna is only, 5 x 5 x 2.8 mm(3) which makes it easy to integrate it in LTCC transceiver modules.