Microstructural evolution and hardness changes in the interface of Cu/316L joint materials under aging and ion irradiation

Microstructural evolution and hardness changes in the interface of Cu/316L joint materials under aging and ion irradiation
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DOI:
10.1016/j.jnucmat.2004.04.326
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发表时间:
2004-08
影响因子:
3.1
通讯作者:
Qiu Xu;T. Yoshiie;T. Muroga;N. Yoshida;T. Iwai;D. Edwards
Qiu Xu;T. Yoshiie;T. Muroga;N. Yoshida;T. Iwai;D. Edwards
中科院分区:
工程技术2区
文献类型:
--
作者:
Qiu Xu;T. Yoshiie;T. Muroga;N. Yoshida;T. Iwai;D. Edwards

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研究了时效和离子辐照对CuNiBe/316L和CuAl25/316L接头材料显微组织稳定性和硬度变化的影响。673 K时效1000 h或573、673 K ~ 10 dpa Ni离子辐照均未促进界面的相互扩散和孔洞膨胀。辐照能提高Cu合金和不锈钢的硬度,而时效能降低除CuNiBe合金外的硬度。CuNiBe合金的硬度变化大于CuAl25合金。硬度的变化会对接头材料的力学性能产生显著影响。
The effects of aging and ion irradiation on microstructure stability and hardness change in the joint materials of CuNiBe/316L and CuAl25/316L have been investigated in the present study. The aging at 673 K for 1000 h or Ni ion irradiation at 573 and 673 K to 10 dpa did not promote the interdiffusion and void swelling at the interface. The hardness in both Cu alloys and stainless steel was increased by irradiation, however, it was decreased by aging except for CuNiBe alloy. The hardness change in CuNiBe alloy was larger than that in CuAl25 alloy. The hardness changes would have a significant effect on the mechanical properties of joint materials.