Electrodeposited Cu‐Ni Textured Superlattices
Electrodeposited Cu‐Ni Textured Superlattices
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电沉积铜镍织构超晶格
DOI：
10.1149/1.2095930
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发表时间：
1988
期刊：
影响因子：
--
通讯作者：
M. Dariel
中科院分区：
文献类型：
--
作者：
D. Lashmore;M. Dariel
通过在取向的单晶铜基底上电沉积，已经产生了交替的2-3 nm厚的铜和镍层的牺牲分层材料。从基底上化学去除的薄层的X射线衍射检查表明，已经产生了具有强外延关系的连贯的、相对均匀的涂层。特别地，通过电沉积获得显示织构化[110]取向的人工层状Cu-Ni合金。非相干形核导致在所有衬底上存在不同量的随机取向的合金晶粒，但特别是对于[100]取向。
Artificially layered materials of alternating 2–3 nm thick copper and nickel layers have been produced by electrodeposition on oriented single‐crystal copper substrates. X‐ray diffraction examination of thin layers chemically removed from the substrate showed that a coherent, relatively homogeneous coating, with a strong epitaxial relationship, had been produced. In particular, artificially layered Cu‐Ni alloys displaying a textured [110] orientation were obtained by electrodeposition. Noncoherent nucleation leads to the presence of various amounts of randomly oriented alloy grains on all substrates but, in particular, for the [100] orientation.