K.Yasuda,H.Akamizu,K.Fujimoto,S.Nakata: "Evaluation of Wettability for Microelectronic Materials by Reflow-mode Wetting Balance Test"Proc.26th IEEE/CPMT International Electronics Manufacturing Technology Symposium IEMT 2000,Santa Clara, Oct.2000. 26. 247-
K.Yasuda,H.Akamizu,K.Fujimoto,S.Nakata: "Evaluation of Wettability for Microelectronic Materials by Reflow-mode Wetting Balance Test"Proc.26th IEEE/CPMT International Electronics Manufacturing Technology Symposium IEMT 2000,Santa Clara, Oct.2000. 26. 247-
复制标题
K.Yasuda、H.Akamizu、K.Fujimoto、S.Nakata:“通过回流模式润湿平衡测试评估微电子材料的润湿性”Proc.26th IEEE/CPMT 国际电子制造技术研讨会 IEMT 2000,圣克拉拉,10 月
DOI:
--
复制
发表时间:
--
期刊:
影响因子:
--
通讯作者:
中科院分区:
文献类型:
--
作者: