A 23 mW 256-tap 8 MSample/s QPSK matched filter for DS-CDMA cellular telephony using recycling integrator correlators

A 23 mW 256-tap 8 MSample/s QPSK matched filter for DS-CDMA cellular telephony using recycling integrator correlators
复制标题

用于 DS-CDMA 蜂窝电话的 23 mW 256 抽头 8 MSample/s QPSK 匹配滤波器,使用循环积分器相关器

DOI:
10.1109/isscc.2000.839813
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发表时间:
2000
期刊:
2000 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.00CH37056)
影响因子:
--
通讯作者:
K. Iizuka
K. Iizuka
中科院分区:
--
文献类型:
--
作者:
D. Senderowicz;S. Azuma;H. Matsui;K. Hara;S. Kawama;Y. Ohta;M. Miyamoto;K. Iizuka

文献摘要

被引文献

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在直接序列码分多址(DS-CDMA)中,匹配滤波器计算由伪随机噪声(PN)序列和复制PN序列扩展的接收信号的互相关函数。这样的匹配滤波器可以看作是一个有限脉冲响应(FIR)滤波器,PN序列用作二进制抽头权重,最小化DS-CDMA接收机中的搜索和同步时间。本文介绍了一种基于循环积分器(RIC)实现匹配滤波器的方法,该方法使用模拟和数字处理的合理组合,以最大限度地减少面积和功耗。匹配滤波器由RIC阵列、存储PN序列的循环移位寄存器和逐个传输相关值的旋转多路复用器组成。该实现提供:1)不需要快速ADC的输入模拟信号处理能力; 2)已经数字编码的输出流; 3)用于开关电容器(SC)积分器的小电容器比;以及4)用于可用技术和扩频比(即PN序列的长度)的最小管芯面积和电流消耗。制作工艺采用0.35 /spl μ/m CMOS双金属双多晶硅工艺。该芯片的面积为22.8 mm/sup 2/,功耗为23 mW,采用1.8 V电源供电。
In direct sequence code division multiple access (DS-CDMA), matched filters calculate the cross-correlation function of a received signal spread by a pseudo-random noise (PN) sequence and a replica PN sequence. A matched filter like this can be viewed as a finite impulse response (FIR) filter with a PN sequence used as the binary tap weights, minimizing search and synchronization times in DS-CDMA receivers. This paper introduces an approach for implementing matched filters based on recycling integrator correlators (RICs) that use a sensible combination of analog and digital processing to minimize area and power consumption. The matched filter is organized by combining an array of RICs, a cyclic shift register which stores a PN sequence, and a rotary multiplexer which transfers the correlation values one by one. This implementation provides: 1) an input analog signal processing capability without the need of a fast ADC; 2) an already digitally-coded output stream; 3) small capacitor ratios for the switched-capacitor (SC) integrators; and 4) minimum die-area and current consumption for the available technology and the spreading ratio, that is, the length of the PN sequence. The fabrication process is a 0.35 /spl mu/m CMOS double-metal, double-poly process. The chip occupies 22.8 mm/sup 2/ and dissipates 23 mW with a 1.8 V power supply.