ASSESSMENT OF RELIABILITY ENHANCEMENT IN HIGH-POWER CPUs AND GPUs USING DYNAMIC DIRECT-TO-CHIP LIQUID COOLING

ASSESSMENT OF RELIABILITY ENHANCEMENT IN HIGH-POWER CPUs AND GPUs USING DYNAMIC DIRECT-TO-CHIP LIQUID COOLING
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使用动态芯片直接液冷技术增强高功率 CPU 和 GPU 的可靠性评估

DOI:
10.1615/jenhheattransf.2022043858
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发表时间:
2022
影响因子:
2.3
通讯作者:
Agonafer, Dereje
Agonafer, Dereje
中科院分区:
工程技术4区
文献类型:
--
作者:
Shahi, Pardeep;Mathew, Amith;Saini, Satyam;Bansode, Pratik;Kasukurthy, Rajesh;Agonafer, Dereje

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