Constructing three-dimensional boron nitride network for highly thermally conductive epoxy resin composites
Constructing three-dimensional boron nitride network for highly thermally conductive epoxy resin composites
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DOI：
10.1002/pc.26490
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发表时间：
2022-02-04
影响因子：
5.2
通讯作者：
Zhang, Chun
中科院分区：
文献类型：
--
作者：
Wu, Xian;Liu, Wei;Zhang, Chun
聚合物基体中热传导通道的构建在导热复合材料中起着关键作用。本研究通过分解牺牲材料，成功制备了三维氮化硼（BN）骨架。用液态环氧树脂进一步渗透得到蜂窝状结构的3D-BN骨架。借助于3D-BN骨架形成的导热通道，当BN体积%为55.85时，EP/3D-BN复合材料的最大导热系数达到3.53 W/m中心点K，是纯EP的17.6倍。EP/3D-BN复合材料在加热和冷却过程中具有很强的散热能力。这项工作为开发用于电子热管理的导热复合材料提供了一种简便的方法。
Construction of heat conduction channels in polymer matrix plays a key role in thermally conductive composite. In this work, three-dimensional (3D) boron nitride (BN) framework was successfully fabricated by decomposing the sacrificial material. The resultant 3D-BN framework with honeycomb-like structure was further infiltrated with liquid epoxy resin. With the aid of thermally conductive pathways formed by the 3D-BN framework, the maximum thermal conductivity of EP/3D-BN composites reaches 3.53 W/m center dot K with 55.85 vol% BN, which is 17.6 times larger than that of pure EP. The EP/3D-BN composites demonstrate strong capability to dissipate the heat during heating and cooling processes. This work provides a facile method for developing thermal conductive composites applied in thermal management for electronics.