Connecting Microstructures for Multiscale Topology Optimization With Connectivity Index Constraints
Connecting Microstructures for Multiscale Topology Optimization With Connectivity Index Constraints
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DOI：
10.1115/1.4041176
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发表时间：
2018-10
影响因子：
3.3
通讯作者：
Zongliang Du;Xiao-Yi Zhou;R. Picelli;H. Kim
中科院分区：
文献类型：
--
作者：
Zongliang Du;Xiao-Yi Zhou;R. Picelli;H. Kim
随着先进制造技术的飞速发展和微尺度特征加工能力的提高，结构材料在许多物理领域受到越来越多的关注。在拓扑优化中，利用均匀化理论和周期性边界条件，可以将此类设计问题视为具有重复单元的结构材料。当考虑在结构中具有空间变化的多个建筑材料时，拓扑解决方案中出现了挑战，其可能不在相邻材料架构之间连接。本文提出了一种新的度量方法--连通性指数（CI），用来量化材料的拓扑连通性，并将其作为多尺度拓扑优化的约束条件，以实现材料的连通结构。数值研究表明，额外的约束导致微结构的拓扑结构，这是连接良好，并没有实质性地损害其最优性。
With the rapid developments of advanced manufacturing and its ability to manufacture microscale features, architected materials are receiving ever increasing attention in many physics fields. Such a design problem can be treated in topology optimization as architected material with repeated unit cells using the homogenization theory with the periodic boundary condition. When multiple architected materials with spatial variations in a structure are considered, a challenge arises in topological solutions, which may not be connected between adjacent material architecture. This paper introduces a new measure, connectivity index (CI), to quantify the topological connectivity, and adds it as a constraint in multiscale topology optimization to achieve connected architected materials. Numerical investigations reveal that the additional constraints lead to microstructural topologies, which are well connected and do not substantially compromise their optimalities.