The changing automotive environment: High-temperature electronics
The changing automotive environment: High-temperature electronics
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DOI：
10.1109/tepm.2004.843109
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发表时间：
2004-07-01
影响因子：
--
通讯作者：
Christopher, M
中科院分区：
文献类型：
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作者：
Johnson, RW;Evans, JL;Christopher, M
发动机罩下的汽车环境非常恶劣，汽车电子行业的当前趋势将推动电子元件的温度范围。将发动机控制单元放置在发动机上以及将变速器控制单元放置在变速器上或变速器中的要求将使环境温度超过125 ℃。然而，极端的成本压力、不断提高的可靠性要求（10年/241 350 km）和现场故障成本（召回、责任、客户忠诚度）将使温度向更高的温度转变。逐渐发生。将使用发动机和变速器中最冷的位置。这些大的主体确实提供了相当大的散热，以减少由于控制单元中的功率耗散而导致的温度上升。大多数短期应用将在150 ℃或更低的温度下进行，这些将是最差情况下的温度，而不是标称温度。过渡到X-by-wire技术，用机电系统取代机械和液压系统，将需要更多的电力电子设备。将功率晶体管和智能功率器件集成到机电致动器中将需要功率器件在175摄氏度至200摄氏度的温度下工作。混合动力汽车和燃料电池汽车也将推动对更高温度电力电子设备的需求。在混合动力和燃料电池汽车的情况下，高温将是由于功率耗散。高温设备的替代品是增加重量和成本的热管理系统。最后，随着更多电控系统的加入，车辆中传感器的数量也在增加。这些传感器中的许多必须在高温环境中工作。最苛刻的应用是废气传感器和气缸压力或燃烧传感器。汽车系统中的高温电子产品将继续增长，但随着成本和可靠性问题的解决，这将是渐进的。本文探讨了更高的温度操作的动机，即使在125 degreesC与新的封装风格的封装限制，并在半导体器件和封装水平的挑战，因为温度超过125 degreesC的审查结束。
The underhood automotive environment is harsh and current trends in the automotive electronics industry will be pushing the temperature envelope for electronic components. The desire to place engine control units on the engine and transmission control units either on or in the transmission will push the ambient temperature above 125 degreesC. However, extreme cost pressures, increasing reliability demands (10 year/241 350 km) and the cost of field failures (recalls, liability, customer loyalty) will make the shift to higher temperatures. occur incrementally. The coolest spots on engine and in the transmission will be used. These large bodies do provide considerable heat sinking to reduce temperature rise due to power dissipation in the control unit. The majority of near term applications will be at 150 degreesC or less and these will be worst case temperatures, not nominal. The transition to X-by-wire technology, replacing mechanical and hydraulic systems with electromechanical systems will require more power electronics. Integration of power transistors and smart power devices into the electromechanical actuator will require power devices to operate at 175 degreesC to 200 similar toC. Hybrid electric vehicles and fuel cell vehicles will also drive the demand for higher temperature power electronics. In the case of hybrid electric and fuel cell vehicles, the high temperature will be due to power dissipation. The alternates to high-temperature devices are thermal management systems which add weight and cost. Finally, the number of sensors in vehicles is increasing as more electrically controlled systems are added. Many of these sensors must work in high-temperature environments. The harshest applications are exhaust gas sensors and cylinder pressure or combustion sensors. High-temperature electronics use in automotive systems will continue to grow, but it will be gradual as cost and reliability issues are addressed. This paper examines the motivation for higher temperature operation, the packaging limitations even at 125 degreesC with newer package styles and concludes with a review of challenges at both the semiconductor device and packaging level as temperatures push beyond 125 degreesC.