Recycling of waste printed circuit boards into ion exchange resin

Recycling of waste printed circuit boards into ion exchange resin
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DOI:
10.1039/c4ra12094a
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发表时间:
2015
期刊:
影响因子:
3.9
通讯作者:
Jianqiu Zhang;Tao Tian;Jinyang Chen;J. Zu;Yangjun Wang
Jianqiu Zhang;Tao Tian;Jinyang Chen;J. Zu;Yangjun Wang
中科院分区:
化学3区
文献类型:
--
作者:
Jianqiu Zhang;Tao Tian;Jinyang Chen;J. Zu;Yangjun Wang

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回收废旧印刷电路板(wpcb)的非金属成分,主要是热固性环氧树脂(tepr),是相当困难的,因为它们是不溶的和不灵活的。我们报道了一种用硫酸处理将tepr转化为离子交换树脂的新方法,所得样品的平衡离子交换容量(IEC)为1.63 meq g−1。FTIR表明tepr被硫酸修饰,x射线光电子能谱(XPS)证实了引入了磺酸基团(-SO3−)。经TG-DTG分析,制备的离子交换树脂在200℃下稳定。对Cu(II)和Ca(II)的最大吸附量分别为23.30 mg g−1和56.27 mg g−1。Langmuir模型比Freundlich模型更适合于吸附。Cu(II)和Ca(II)的活化能Ea分别为21.18和48.53 kJ mol−1,具有准二级动力学。
Recycling the nonmetal components of waste printed circuit boards (WPCBs), mainly thermosetting epoxy resins (TEPRs), is quite difficult because they are insoluble and inflexible. We report a new method to convert TEPRs into ion exchange resin by treatment with sulphuric acid and the equilibrium ion exchange capacity (IEC) of the produced sample is 1.63 meq g−1. FTIR indicated that TEPRs were modified by sulphuric acid and X-ray photoelectron spectroscopy (XPS) verified that sulfonic acid group (–SO3−) was introduced. The produced ion exchange resin was stable up to 200 °C by TG-DTG analysis. The maximum adsorption capacities for Cu(II) and Ca(II) were 23.30 and 56.27 mg g−1, respectively. The Langmuir model gave a better fit for adsorption than the Freundlich model. The activation energies (Ea) were 21.18 and 48.53 kJ mol−1 for Cu(II) and Ca(II), respectively, with pseudo-second-order kinetics.