Fabrication of atomic-scale gold junctions by electrochemical plating using a common medical liquid
Fabrication of atomic-scale gold junctions by electrochemical plating using a common medical liquid
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DOI：
10.1063/1.1897444
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发表时间：
2005-03
影响因子：
4
通讯作者：
A. Umeno;K. Hirakawa
中科院分区：
文献类型：
--
作者：
A. Umeno;K. Hirakawa
纳米分离的金结的制造已经使用“碘酊”（一种被称为消毒剂的医用液体）作为蚀刻/沉积电解质进行。在金溶解的碘酊中，金电极生长或腐蚀得足够缓慢，以形成原子尺度的量子点接触。在室温下，电化学沉积过程中的电阻演变在电阻量子（2 e2 scinh）−1的整数倍处显示出平台（e：基本电荷，h：普朗克常数）。碘酊是一种市售的常用材料，这使得制造过程简单且具有成本效益。此外，与传统的电化学方法相比，这种方法不含剧毒的氰化物或非常强的酸。
Fabrication of nanometer-separated gold junctions has been performed using “iodine tincture,” a medical liquid known as a disinfectant, as an etching/deposition electrolyte. In the gold-dissolved iodine tincture, gold electrodes were grown or eroded slowly enough to form quantum point contacts in an atomic scale. The resistance evolution during the electrochemical deposition showed plateaus at integer multiples of the resistance quantum, (2e2∕h)−1, at room temperature (e: the elementary charge, h: the Planck constant). Iodine tincture is a commercially available common material, which makes the fabrication process to be simple and cost effective. Moreover, in contrast to the conventional electrochemical approaches, this method is free from highly toxic cyanide compounds or extraordinarily strong acids.