Multislice imaging of integrated circuits by X-ray ptychography
Multislice imaging of integrated circuits by X-ray ptychography
复制标题
利用 X 射线叠层成像技术对集成电路进行多层成像
DOI：
10.1017/s1431927618012552
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发表时间：
2018
影响因子：
2.8
通讯作者：
Yukio Takahashi
中科院分区：
文献类型：
--
作者：
Kei Shimomura;Makoto Hirose;Takaya Higashino;Yukio Takahashi
X射线层析成像是一种基于多个衍射图的迭代相位恢复的扫描型相干X射线衍射成像，它以高于10 nm的高空间分辨率提供样品的内部信息。X射线层析成像与计算机层析成像相结合，实现了高分辨率的三维(3D)图像。到目前为止，已经实现了优于20 nm的3D分辨率[1]。近年来，对大体积样品的高分辨率成像提出了更高的要求。投影近似是限制样品的空间分辨率和最大厚度的重要因素。样品厚度和可达到的空间分辨率之间的关系被描述为[2]
X-ray ptychography is a scanning type of coherent X-ray diffraction imaging based on iterative phase retrieval of multiple diffraction patterns, and provides internal information of a sample at a high spatial resolution potentially better than 10 nm. X-ray ptychography combined with computed tomography realizes high-resolution three-dimensional (3D) images. So far, a 3D resolution better than 20 nm has been achieved [1]. Recently, the high-resolution imaging of large-volume samples has been required. The projection approximation is an important factor that limits both the spatial resolution and maximum thickness of the sample. The relationship between the sample thickness and the achievable spatial resolution is described as [2]