Qiang Yu: "A Study of Mechanical/Thermal Stress Behavior due to Global and Local Thermal Mismatch of Dissimilar Materials in Electronic Packaging (in press)," Proceedings of the 1995 ASME International, Intersociety Electronic Packaging Conference & Exhib
Qiang Yu: "A Study of Mechanical/Thermal Stress Behavior due to Global and Local Thermal Mismatch of Dissimilar Materials in Electronic Packaging (in press)," Proceedings of the 1995 ASME International, Intersociety Electronic Packaging Conference & Exhib
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于强：“电子封装中异种材料全局和局部热失配导致的机械/热应力行为的研究（正在印刷中）”，1995 年 ASME 国际、社会间电子封装会议论文集
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