EXPERIMENTAL OBSERVATIONS OF ORDERLY STRUCTURES IN COPPER FILMS DEPOSITED ON LIQUID SUBSTRATES
EXPERIMENTAL OBSERVATIONS OF ORDERLY STRUCTURES IN COPPER FILMS DEPOSITED ON LIQUID SUBSTRATES
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液体基底上沉积的铜膜有序结构的实验观察
DOI：
10.1142/s0218625x0901272x
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发表时间：
2009-06
影响因子：
1.1
通讯作者：
SEN-JIANG YU
中科院分区：
文献类型：
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作者：
MIAO-GEN CHEN;YUAN-XIN FENG;BO YANG;ZHI-WEI JIAO;SEN-JIANG YU
本文用光学显微镜研究了在近乎自由持续的铜（Cu）膜体系中观察到的有序结构，即条带。该能带由大量平行键形畴组成，宽度w不同，长度l几乎一致。研究表明，Cu薄膜的形貌对沉积速率非常敏感，即随着沉积速率f的增加，矩形畴的能带首先逐渐变得不规则，然后完全消失。实验表明，有序图案的生长机制可以用薄膜内部应力的松弛来解释，这与薄膜在液体衬底上的特征边界条件和固液界面接近零的粘附有关。
In this paper, an optical microscopy study of orderly structures, namely bands, which are observed in a nearly free sustained copper (Cu) film system, is presented. The band is composed of a large number of parallel key-formed domains with different width w but nearly uniform length L. This study shows that the morphologies of the Cu films are very susceptible to the deposition rate, i.e. with the increase in the deposition rate f, the bands with rectangular domains first become irregular gradually and then disappear completely. The experiment indicates that the growth mechanism of the orderly patterns can be explained in terms of the relaxation of the internal stress in the films, which is related to the characteristic boundary condition of the films on the liquid substrates and the nearly zero adhesion of the solid–liquid interface.