The degree of fragmentation of metallocomplexes with cleavage of the metal-ligand bond
The degree of fragmentation of metallocomplexes with cleavage of the metal-ligand bond
复制标题
金属配合物因金属-配体键断裂而断裂的程度
DOI：
10.1007/bf02495560
复制
发表时间：
1998
影响因子：
1.7
通讯作者：
A. I. Belokon'
中科院分区：
文献类型：
--
作者：
Y. Nekrasov;D. V. Zverev;A. I. Belokon'
提出了一种利用金属-配体键断裂来估计金属配合物在电子冲击下破碎程度的新方法。该方法基于质谱数据。本文选取了67种具有代表性的不同类别的金属有机化合物，如金属羰基、金属茂烯、菊酯类化合物和苯二甲基羰基衍生物，研究了金属-配体键的断裂程度与解离能之间的关系。相关性表明，该参数可用于气相金属配合物反应性的定量估计。
A new method for estimating the degree of fragmentation of metallocomplexes under electron impact with cleavage of the metal-ligand bond was suggested. The method is based on mass spectrometric data. Using a representative selection of 67 organometallic compounds of different classes such as metal carbonyls, metallocenes, and cymantrene and bensenechrometricarbonyl derivatives, a correlation between the degree of fragmentation and the dissociation energy of metal-ligand bonds was developed. The correlation is evidence that the parameter can be used for quantitative estimation of the reactivity of metallocomplexes in the gas phase.