A multiphase simulation study of electrochemical discharge machining of glass
A multiphase simulation study of electrochemical discharge machining of glass
复制标题
玻璃电化学放电加工的多相模拟研究
DOI：
10.1007/s00170-019-04318-5
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发表时间：
2019
期刊：
影响因子：
--
通讯作者：
Sundaram, Murali
中科院分区：
文献类型：
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作者：
Kolhekar, Ketaki;Sundaram, Murali
由于玻璃在微流体、光学、电子和生物技术工业中的大量应用，玻璃的微机械加工变得重要。电化学放电加工是一种新兴的非传统加工方法，具有实现玻璃微细加工的潜力。在通过电火花加工玻璃的过程中，材料去除涉及通过工具和气膜之间的放电进行的热加工。这些放电的能量受气膜特性的影响，并影响加工结果。本文采用有限元模拟与实验相结合的方法，研究了电火花线切割加工过程中气膜特性对加工过切的影响。多相模拟设置结合了玻璃和电解质的组合电化学系统。研究了由于电解液液位的变化而引起的气膜特性的变化以及相应的过切量的变化。结果表明，气膜厚度随电解液浓度的增加而增加，而气膜稳定性则表现出相反的趋势。这导致随着电解液水平的增加，加工中的过切增加。在模拟中观察到的这种趋势通过实验进行了验证。
Micromachining of glass has gained importance due to numerous applications of glass in microfluidics, optics, electronics, and biotechnology industry. Electrochemical discharge machining (ECDM) is an emerging nontraditional process which has the potential for micromachining of glass with minimal surface damages. Material removal during the machining of glass by ECDM involves thermal machining by electrical discharges between the tool and the gas film. The energy of these discharges is influenced by the gas film characteristics and affects the machining results. In this study, a combined approach of finite element simulation and experimentation is used to study the ECDM process to understand the impact of gas film characteristics on the overcut in machining. The multiphase simulation setup incorporates a combined electrochemical system of glass and electrolyte. The changes in the gas film characteristics due to the variations in the level of electrolyte and the corresponding changes in the overcut are studied. It was observed that the gas film thickness increased with an increase in the level of electrolyte and the gas film stability showed an opposite trend. This resulted in an increase in the overcut in the machining with the increase in the level of electrolyte. This trend observed in the simulation was validated with experimentation.
用于分析电化学放电加工中材料去除的三维有限元模拟方法
DOI：
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发表时间：
2017
期刊：
影响因子：
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作者：
M. Goud;A. Sharma
通讯作者：
A. Sharma