Simulation Methodologies for Acoustic Noise Induced by Multilayer Ceramic Capacitors of Power Distribution Network in Mobile Systems
Simulation Methodologies for Acoustic Noise Induced by Multilayer Ceramic Capacitors of Power Distribution Network in Mobile Systems
复制标题
DOI：
10.1109/temc.2020.3019438
复制
发表时间：
2021-04-01
影响因子：
2.1
通讯作者：
Yang, Zhiping
中科院分区：
文献类型：
--
作者：
Sun, Yin;Wu, Songping;Yang, Zhiping
本文通过对印制电路板（PCB）振动特性的仿真研究，对多层陶瓷电容器（mlcc）产生的噪声进行了研究。简要总结了板振动理论，了解了影响板固有振动特性的关键参数。确定的关键参数是每层板的厚度、质量密度和杨氏模量。为了适应实际电路板制造过程中参数的变化，提出了PCB振动模态响应的统计仿真模型。仿真结果与实测结果具有良好的相关性。通过仿真分析了板的振动特性对各层识别参数的敏感性。在导出板固有振动特性的基础上，通过模态叠加进一步分析了电容器作为强制激励时PCB的振动特性。模拟结果与实测结果也具有良好的相关性。利用所提出的仿真方法，工程师可以在设计早期评估板的振动特性，并推导出一些放置mlcc的设计准则，以降低噪声。
In this article, multilayer ceramic capacitors (MLCCs) induced acoustic noise is studied through simulation investigation of the vibration behavior of the printed circuit board (PCB). The board vibration theory is briefly summarized to understand the key parameters influencing intrinsic board vibration properties. The identified key parameters are the thickness, mass density, and Young's modulus of each board layer. To accommodate the parameter variations in real board fabrication process, a statistical simulation model for PCB vibration modal response is proposed. The simulation results have shown good correlation with the measurement. The sensitivity analysis of board vibration properties to the identified parameters of each layer has also been conducted through simulation. Based on the derived intrinsic board vibration properties, the PCB vibration behavior with capacitor as forced excitation is further analyzed through modal superposition. The simulated results also exhibit good correlation with measurement. With the proposed simulation methods, engineers can evaluate the board vibration behavior at early design stage and some design guidelines for placing MLCCs can be derived to reduce acoustic noise.