Heat transfer of liquid metal alloy on copper plate deposited with film of different surface free energy

Heat transfer of liquid metal alloy on copper plate deposited with film of different surface free energy
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不同表面自由能薄膜沉积铜板上液态金属合金的传热

DOI:
10.1088/1674-1056/ab48dc
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发表时间:
2019-11
期刊:
Chin. Phys. B
影响因子:
--
通讯作者:
Gang Zhao
Gang Zhao
中科院分区:
其他
文献类型:
--
作者:
Huilong Yan;Jinliang Yan;Gang Zhao

文献摘要

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液态金属合金(LMAs)是电子冷却用热界面材料(TIM)的潜在候选者。采用直流磁控溅射法在抛光的铜基板上制备了Ag、Ti、Cu、Ni、Mo和W缓冲层,利用液滴形状分析仪测量了去离子水和二碘甲烷在缓冲层上的接触角,并利用Owens-Wendt-Kaelble方程计算了缓冲层的表面自由能。通过将成膜的Cu板和LMAs混合来制备样品。采用激光闪光分析法测量了样品的热性能。缓冲层的超临界流体效应对界面传热有很大的影响,而测量温度对样品的热性能没有明显的影响。随着缓冲层的SFE增加,润湿性、热扩散率和热导率增强,并且接触热阻减小。
Liquid metal alloys (LMAs) are the potential candidates of thermal interface materials (TIMs) for electronics cooling. In the present work, buffer layers of Ag, Ti, Cu, Ni, Mo, and W were deposited on polished Cu plates by DC magnetron sputtering, the contact angles of de-ionized water and diiodomethane on the buffer layers were measured by an easy drop shape analyzer and the surface free energies (SFEs) of the buffer layers were calculated by the Owens–Wendt–Kaelble equation. Samples were prepared by sandwiching the filmed Cu plates and LMAs. The thermal properties of the samples were measured by laser flash analysis method. The SFE of the buffer layer has a strong influence on the interface heat transfer, whereas the measurement temperature has no obvious effect on the thermal properties of the samples. As the SFE of the buffer layer increases, the wettability, thermal diffusivity, and thermal conductivity are enhanced, and the thermal contact resistance is decreased.