Subcooled flow boiling under an electric field on surface enhanced by diamond particles deposition
Subcooled flow boiling under an electric field on surface enhanced by diamond particles deposition
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DOI：
10.1016/j.ijheatmasstransfer.2019.01.033
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发表时间：
2019-05
影响因子：
5.2
通讯作者：
I. Kano
中科院分区：
文献类型：
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作者：
I. Kano
本研究调查了高热通量冷却装置的开发。对氟化介电液体（AE-3000、CF3CH2OCF2CF2H）的过冷流动沸腾性能进行了实验表征。将制作有十个1000μm狭缝的电极放置在加热表面上方600μm处，并通电以在加热表面和电极之间的间隙中产生高电场。在不同的入口流量（0.97、1.9 和 2.9g/s）和初始流入温度（30、40 和 50°C）下评估了经过金刚石颗粒和镍共电沉积的加热壁表面的热性能。对间隙施加−5kV/mm的电场，并确定了电场下的性能增强机制。在入口流速为 1.9g/s 和初始流入温度为 50°C 时，电场性能得到最佳增强。在此条件下，临界热流密度（CHF）性能达到120.6W/cm2，传热系数为40.0 kW/（m2K）。一旦过冷液体根据入口温度和流量抑制沸腾过程，从显热和潜热导出的预测方程就无法预测预期的 CHF。
This study investigates the development of a high heat-flux cooling device. The subcooled flow boiling performance of a fluorinated dielectric liquid (AE-3000, CF3CH2OCF2CF2H) was experimentally characterized. An electrode fabricated with ten 1000 μm slits was placed at 600 μm above a heated surface, and was energized to generate a high electric field in the gap between the heated surface and the electrode. The heat performance of the heated wall surface, which had undergone co-electrodeposition of diamond particles and nickel, was evaluated at various inlet flow rates (0.97, 1.9, and 2.9 g/s) and initial inflow temperatures (30, 40, and 50 °C). An electric field of −5 kV/mm was applied to the gap, and the performance enhancing mechanisms under electric field were identified. The best enhancement of performance upon electric filed was obtained at an inlet flow rate of 1.9 g/s and initial inflow temperature of 50 °C. Under these conditions, the critical heat flux (CHF) performance reached 120.6 W/cm2and the heat transfer coefficient was 40.0 kW/(m2K). A predictive equation derived from the sensible and latent heats failed to predict the expected CHF, once the subcooled liquid suppressed the boiling process depending on the inlet temperature and flow rate.