Thermoelectric coolers for high-power-density 3D electronics heat management
Thermoelectric coolers for high-power-density 3D electronics heat management
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DOI：
10.1063/5.0088129
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发表时间：
2022-04-18
影响因子：
4
通讯作者：
Priya, Shashank
中科院分区：
文献类型：
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作者：
Nozariasbmarz, Amin;Kishore, Ravi Anant;Priya, Shashank
三维 (3D) 电子学的未来进步需要强大的热管理方法。热电冷却器 (TEC) 是可靠的固态热泵设备，具有高冷却能力，可以满足新兴 3D 微电子设备的要求。在这里，我们首先使用计算模型提供用于电子冷却的 TEC 设计，然后通过实验验证主要预测。研究了器件厚度、腿密度和接触电阻等关键器件参数，以了解它们对 TEC 性能的影响。我们的结果表明，通过优化 TE 腿高度和封装密度可以实现高冷却功率密度。 TEC 的扩展被证明可以提供超高的冷却功率密度。由 AIP Publishing 独家许可发布。
Future advancements in three-dimensional (3D) electronics require robust thermal management methodology. Thermoelectric coolers (TECs) are reliable and solid-state heat pumping devices with high cooling capacity that can meet the requirements of emerging 3D microelectronic devices. Here, we first provide the design of TECs for electronics cooling using a computational model and then experimentally validate the main predictions. Key device parameters such as device thickness, leg density, and contact resistance were studied to understand their influence on the performance of TECs. Our results show that it is possible to achieve high cooling power density through optimization of TE leg height and packing density. Scaling of TECs is shown to provide ultra-high cooling power density.& nbsp;Published under an exclusive license by AIP Publishing.