Single-point diamond turning of CaF2 for nanometric surface
Single-point diamond turning of CaF2 for nanometric surface
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DOI：
10.1007/s00170-003-1747-2
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发表时间：
2004-11
期刊：
影响因子：
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通讯作者：
Jiwang Yan;J. Tamaki;K. Syoji;T. Kuriyagawa
中科院分区：
文献类型：
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作者：
Jiwang Yan;J. Tamaki;K. Syoji;T. Kuriyagawa
CaF2单晶是一种重要的光学材料。在这项工作中，单点金刚石车削实验进行了调查的纳米加工特性的CaF2。研究了刀具进给量、刀具前角、工件晶体取向和切削液等因素的影响。结果发现，两种主要类型的微破裂不同的机制限制了韧性政权加工的可能性。微破裂的临界条件强烈地依赖于刀具前角和切削液的类型。研究结果还表明，其中一种微裂纹是由热效应引起的，在干切削条件下，采用足够小的未变形切屑厚度和适当的负前角可以完全消除这种微裂纹。连续芯片和韧性切割表面的纳米粗糙度产生。
Single-crystal CaF2is an important optical material. In this work, single-point diamond turning experiments were performed to investigate the nanometric machining characteristics of CaF2. The effects of tool feed, tool rake angle, workpiece crystal orientation and cutting fluid were examined. It was found that two major types of microfracturing differing in mechanism limited the possibility of ductile regime machining. The critical conditions for microfracturing depend strongly on the tool rake angle and the type of cutting fluid. The results also indicate that one type of the microfractures is caused by thermal effect, and can be completely eliminated by using a sufficiently small undeformed chip thickness and an appropriate negative rake angle under dry cutting conditions. Continuous chips and ductile-cut surfaces with nanometric roughness were generated.