Modeling void closure in solid-state diffusion bonding of TC4 alloy
Modeling void closure in solid-state diffusion bonding of TC4 alloy
复制标题
模拟 TC4 合金固态扩散接合中的空隙闭合
DOI：
10.1016/j.vacuum.2019.109120
复制
发表时间：
2020-03-01
期刊：
影响因子：
4
通讯作者：
Li, Jinglong
中科院分区：
文献类型：
--
作者：
Yuan, Lin;Xiong, Jiangtao;Li, Jinglong
建立了一个分析模型来描述使用固态扩散焊（SSDB）制造的接头中界面空隙的闭合情况。该模型考虑了接触表面微凸体的微观变形与接头宏观变形之间的关系，在分析塑性变形和蠕变变形机理之前，首先定量预测了接头宏观变形对结合率的贡献，而不考虑界面空洞的几何形状。结合界面扩散机制和表面扩散机制，研究了孔隙闭合率（即结合率）与结合参数之间的关系。结果表明，在SSDB过程的早期阶段，空洞闭合主要是塑性变形和蠕变变形共同作用的结果。但随着键合时间的增加，表面和界面扩散机制逐渐成为键合的主要驱动力，直至空洞消除。TC4钛合金扩散连接的实验结果验证了该模型的有效性和适用性，表明该模型能够成功地预测连接参数对孔洞闭合（或连接率）演化的影响。
An analytical model is developed in effort to characterize the closure of interface void in the joint fabricated using solid state diffusion bonding (SSDB). Based on considering the relationship between the micro-deformation of the contact surface asperities and the macro-deformation of the joint, the model firstly quantitatively predicates the contribution of macro-deformation of joint on the bonding ratio without assuming the interface void geometries before analyzing the mechanisms of plastic and creep deformation. Furthermore, cooperating with the mechanisms of surface and interface diffusion, the correlation between the void closure (i.e. bonding ratio) and bonding parameters is investigated by the model. The results demonstrate that in the early stage of SSDB process, the void closure is mainly resulted from the contributions of the both mechanisms of plastic and creep deformation. However, with bonding time increasing, the mechanisms of surface and interface diffusion gradually become the dominated driving forces until the void elimination. The efficiency and applicability of the analytical model are verified by experimental results of diffusion bonding of TC4 titanium alloy with specially fabricated bonding surface, which demonstrates that the model can successfully forecast the effect of joining parameters on the void closure (or bonding ratio) evolution.