Cost and performance analysis for mixed-signal system implementation: system-on-chip or system-on-package?
Cost and performance analysis for mixed-signal system implementation: system-on-chip or system-on-package?
复制标题
混合信号系统实施的成本和性能分析：片上系统还是封装系统？
DOI：
10.1109/tepm.2002.807721
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发表时间：
2002
影响因子：
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通讯作者：
H. Tenhunen
中科院分区：
文献类型：
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作者：
M. Shen;Lirong Zheng;H. Tenhunen
集成电路和封装技术的进步为混合信号系统提供了更多的实现选择。新兴技术以片上系统（SoC）和封装系统（SoP）为代表。为了做出最佳系统实施的设计决策，因此在系统设计阶段早期解决各种实施方案的成本和性能问题变得越来越重要。在本文中，我们开发了一种建模技术的先验成本和性能估计的混合信号系统实现。性能模型评估各种噪声隔离技术，例如使用保护环、增加数字和模拟/RF电路部件之间的间隔、使用特殊衬底材料（例如，绝缘体上的硅），以及将系统划分成几个芯片。在成本分析中，新的因素，如额外的芯片面积和额外的工艺步骤，由于混合信号隔离，知识产权（IP）的权利模块或“虚拟组件”的集成，产量和技术兼容性合并逻辑，存储器和模拟/RF电路在一个芯片上，被认为是。最后，一个有效的计算算法，即COMSI，开发了各种混合信号性能约束下的成本估计。使用COMSI进行SoC和SoP集成的案例研究。
Advances in integrated circuits and packaging technologies provided us more implementation options for mixed-signal systems. Emerging technologies are represented by system-on-chip (SoC) and system-on-package (SoP). In order to make a design decision for optimal system implementation, it is hence becoming more and more important to address the cost and performance issues for various implementation options early in a system deign phase. In this paper, we develop a modeling technique for a priori cost and performance estimations for mixed-signal system implementations. The performance model evaluates various noise isolation technologies, such as using guard rings, increasing the separation between digital and analog/RF circuitry parts, using special substrate materials (e.g., silicon-on-insulator), and partitioning the system into several chips. In cost analysis, new factors such as extra chip area and additional process steps due to mixed signal isolation, integration of intellectual property (IP) right module or "virtual components," yield and technology compatibility for merging logic, memory and analog/RF circuits on a single chip, are considered. Finally, an efficient computation algorithm, namely COMSI, was developed for cost estimation under various mixed-signal performance constraints. Case studies for SoC and SoP integration are performed using COMSI.