A high-efficiency broadband WR3 bond wire on-chip antenna
A high-efficiency broadband WR3 bond wire on-chip antenna
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高效宽带 WR3 键合线片上天线
DOI：
10.1049/cp.2018.0941
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发表时间：
2018
期刊：
影响因子：
--
通讯作者：
I. Kallfass
中科院分区：
文献类型：
--
作者：
D. Müller;J. Schaefer;A. Lipp;A. Leuther;T. Zwick;I. Kallfass
本文设计了一种适合与高速MMIC工艺集成的键合线天线。基本天线由一根λ0/4长的键合线组成，连接到射频接触垫的中心导体上。为了提高期望方向上的辐射增益，在λ0/4的距离处增加了一个反射器，由四条额外的键线实现。仿真结果与实测结果吻合较好。在220 ~ 300 GHz频率范围内的有效辐射，260 GHz时的最大增益为10.1 dBi。在中心频率260 GHz处，e面和h面测得的半功率波束宽度分别为15°和84°。仿真结果表明，该系统在240ghz时的最高效率为88%，在全频率范围内的最高效率为65%以上。
This paper presents the design of a bond wire antenna suitable for integration with high-speeds MMIC processes. The basic antenna consists of a λ0/4 long bond wire attached to the center conductor of a radio frequency contact pad. To enhance the radiation gain in the desired direction a reflector, realized by four additional bond wires, was added at a distance of λ0/4. A very good agreement between simulation and measurement was achieved. Efficient radiation in the frequency range 220 to 300 GHz with a maximum gain of 10.1 dBi at 260 GHz was verified by measurements. The measured half power beamwidth at the center frequency of 260 GHz is 15° and 84° in E-plane and H-plane, respectively. The simulations show a maximum efficiency of 88% at 240 GHz and above 65% over the full frequency range.