Abnormal polarity effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect
Abnormal polarity effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect
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DOI：
10.1016/j.scriptamat.2007.05.023
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发表时间：
2007-09
影响因子：
6
通讯作者：
Xinfang Zhang;Jingdong Guo;J. Shang
中科院分区：
文献类型：
--
作者：
Xinfang Zhang;Jingdong Guo;J. Shang
研究了电流应力作用下Sn-Zn共晶钎料/Cu互连线的界面反应。在4.26× 104 Acm − 2的恒定直流电作用下，166 h后，阴极金属间化合物层比阳极金属间化合物层厚约2.3μm，出现了异常的“极性效应”。在将温度升高至约185°C时，Cu-Zn化合物在阳极处被Cu-Sn化合物替代，并且在阴极处被Cu-Zn和Cu-Sn化合物的混合物替代。
Interfacial reactions in a eutectic Sn–Zn solder/Cu interconnect were investigated under electric current stressing. After applying a constant direct current at 4.26×104Acm−2for 166h, an abnormal “polarity effect” was found where the intermetallic compound layer at the cathode was about 2.3μm thicker than that at the anode. Upon increasing the temperature to about 185°C, Cu–Zn compounds were replaced by Cu–Sn compounds at the anode and by a mixture of Cu–Zn and Cu–Sn compounds at the cathode.