Immersion cooling nucleate boiling of high power computer chips
Immersion cooling nucleate boiling of high power computer chips
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DOI：
10.1016/j.enconman.2011.08.008
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发表时间：
2012-01-01
影响因子：
10.4
通讯作者：
El-Genk, Mohamed S.
中科院分区：
文献类型：
--
作者：
El-Genk, Mohamed S.
本文介绍了FC-72和HFE-7100介电液体在均匀加热的10 × 10 mm多孔石墨（PG）表面上的饱和和过冷沸腾的实验结果，用于高功率计算机芯片的浸没冷却。实验研究了表面倾斜度（从0 °向上到180 °向下）和液体过冷度（从0到30 K）对核态沸腾传热系数和临界热流密度的影响。本文给出的PG和平面上介质液体自然对流的实验数据和关联式对于在待机模式下冷却芯片具有重要意义，
This paper presents experimental results of saturation and subcooled boiling of FC-72 and HFE-7100 dielectric liquids on uniformly heated, 10 x 10 mm porous graphite (PG) surfaces for potential applications to immersion cooling of high power computer chips. The experiments investigated the effects of surface inclination, from upward-facing (0 degrees) to downward-facing (180 degrees), and liquid subcooling from 0 to 30 K on nucleate boiling heat transfer coefficient and critical heat flux. The presented experimental data and correlations for natural convection of dielectric liquids on PG and plane surfaces are important for cooling chips while in the standby mode when surface heat flux