Scanning and transmission electron microscopies of single-crystal silicon microworn/machined using atomic force microscopy
Scanning and transmission electron microscopies of single-crystal silicon microworn/machined using atomic force microscopy
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DOI：
10.1557/jmr.1997.0421
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发表时间：
1997-12
影响因子：
2.7
通讯作者：
V. Koinkar;B. Bhushan
中科院分区：
文献类型：
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作者：
V. Koinkar;B. Bhushan
原子力显微镜（AFM）通常用于在非常轻的负载下对材料进行微磨损/加工研究。为了了解微观尺度上的材料去除机制，对微磨损/机械加工的单晶硅进行了扫描电子显微镜（SEM）和透射电子显微镜（TEM）研究。微机械单晶硅的SEM研究表明，在轻负载下，材料通过犁削去除。在轻载荷下观察到细颗粒碎屑。在较高载荷下，观察到切割类型和带状碎屑。这些碎片是松散的，可以很容易地通过用AFM针尖扫描来去除。在40 μ N下产生的磨损痕迹的TEM图像显示磨损痕迹内和周围的弯曲轮廓，表明存在残余应力。使用平面图TEM未观察到磨损痕迹内部或外部的位错、裂纹或任何特殊特征。因此，材料主要以脆性方式或通过切削去除，而没有主要的位错活动、裂纹形成和表面处的相变。然而，带状碎片的存在表明也存在一些塑性变形。
Atomic force microscopy (AFM) is commonly used for microwear/machining studies of materials at very light loads. To understand material removal mechanism on the microscale, scanning electron microscopy (SEM) and transmission electron microscopy (TEM) studies were conducted on the microworn/machined single-crystal silicon. SEM studies of micromachined single-crystal silicon indicate that at light loads material is removed by ploughing. Fine particulate debris is observed at light loads. At higher loads, cutting type and ribbon-like debris were observed. This debris is loose and can be easily removed by scanning with an AFM tip. TEM images of a wear mark generated at 40 μ N show bend contours in and around the wear mark, suggesting that there are residual stresses. Dislocations, cracks, or any special features were not observed inside or outside wear marks using plan-view TEM. Therefore, material is mostly removed in a brittle manner or by chipping without major dislocation activity, crack formation, and phase transformation at the surface. However, presence of ribbon-like debris suggests some plastic deformation as well.