Analysis of Large-Strain Extrusion Machining with Different Chip Compression Ratios
Analysis of Large-Strain Extrusion Machining with Different Chip Compression Ratios
复制标题
不同切屑压缩比的大应变挤压加工分析
DOI：
10.1155/2012/851753
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发表时间：
2012-01-01
影响因子：
--
通讯作者：
Li, Qing
中科院分区：
文献类型：
--
作者：
Deng, Wen Jun;Lin, Ping;Li, Qing
大应变挤压加工（LSEM）是一种将材料变形到非常高的塑性应变以生产超细纳米结构材料的新工艺。在开发该技术之前，重要的是要了解工件的变形行为及其与加工参数和摩擦条件的关系。本文报道了有限元法（FEM）分析的LSEM过程中，了解不同的芯片压缩比下的温度场，有效应变和应变速率的演变。还分析了切削力和推力随时间的变化。结果表明，LSEM可以通过改变芯片压缩比的值来产生非常高的应变，从而能够生产纳米结构材料。通过LSEM产生的切屑的形状也可以在几何上得到很好的约束。
Large-Strain Extrusion Machining (LSEM) is a novel-introduced process for deforming materials to very high plastic strains to produce ultra-fine nanostructured materials. Before the technique can be exploited, it is important to understand the deformation behavior of the workpiece and its relationship to the machining parameters and friction conditions. This paper reports finite-element method (FEM) analysis of the LSEM process to understand the evolution of temperature field, effective strain, and strain rate under different chip compression ratios. The cutting and thrust forces are also analyzed with respect to time. The results show that LSEM can produce very high strains by changing in the value of chip compression ratio, thereby enabling the production of nanostructured materials. The shape of the chip produced by LSEM can also be geometrically well constrained.