Detection of quasimolecular ion of Cu(hfac)(tmvs) by ion attachment mass spectrometry
Detection of quasimolecular ion of Cu(hfac)(tmvs) by ion attachment mass spectrometry
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离子附着质谱法检测Cu(hfac)(tmvs)准分子离子
DOI：
10.1116/1.1798751
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发表时间：
2004
期刊：
影响因子：
--
通讯作者：
M. Nakata
中科院分区：
文献类型：
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作者：
Megumi Nakamura;Y. Shiokawa;T. Fujii;M. Takayanagi;M. Nakata
分子离子（三甲基乙烯基硅烷）（1，1，1，5，5，5-六氟乙酰丙酮基）Cu（I）[Cu（hfac）（tmvs）]由于配位键较弱而不能用传统的电离技术如电子碰撞电离质谱法检测到，但已被最近发展的离子附着质谱法（IAMS）首次成功地检测为准分子离子Cu（hfac）（tmvs）Li+。Cu（hfac）（tmvs）是一种广泛用于金属有机化学气相沉积（MOCVD）工艺的材料。在Cu（hfac）（tmvs）的热分解过程中，用IAMS观察到三甲基乙烯基硅烷（tmvs）和六氟乙酰丙酮（Hhfac）作为反应产物。我们还评估了分解过程对温度的依赖性。我们发现IAMS是监测和澄清MOCVD工艺的有效工具。
A molecular ion of (trimethylvinylsilane)(1,1,1,5,5,5-hexafluoroacetyl-acetonato)Cu(I) [Cu(hfac)(tmvs)], which could not be detected by mass spectrometry with conventional ionization techniques such as electron impact ionization because of weak coordination bonds, has been successfully detected as a quasimolecular ion, Cu(hfac)(tmvs)Li+, for the first time by recently developed ion-attachment mass spectrometry (IAMS). Cu(hfac)(tmvs) is a material widely used in the metal organic chemical vapor deposition (MOCVD) process. In the thermal decomposition of Cu(hfac)(tmvs), trimethylvinylsilane (tmvs) and hexafluoroacetylacetone (Hhfac) were observed by IAMS as the reaction products. We also evaluated the dependence of the decomposition process on temperature. We found IAMS to be an effective tool in monitoring and clarifying MOCVD processes.