BOND INSPECTION BY DYNAMIC TIME‐AVERAGE INTERFEROMETRIC HOLOGRAPHY OF ULTRASONICALLY EXCITED PLATES
BOND INSPECTION BY DYNAMIC TIME‐AVERAGE INTERFEROMETRIC HOLOGRAPHY OF ULTRASONICALLY EXCITED PLATES
复制标题
通过超声激励板的动态时间平均干涉全息术进行键合检测
DOI：
10.1121/1.1911991
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发表时间：
1970
影响因子：
2.4
通讯作者：
J. P. Waters
中科院分区：
文献类型：
--
作者：
R. Erf;H. G. Aas;J. P. Waters
在薄板中，利用动态时间平均干涉全息术显示超声激发板的模式可以用于检测某些类型的材料缺陷。提出了一项可行性研究的代表性结果，该结果戏剧性地证明了该方法用于硼环氧预浸料和铝基材之间的键的无损检测的潜力。特别是，当激励频率为20-40 KHz时，可以很容易地识别出小于1 cm2的面积。
In thin plates, the visualization of ultrasonically excited plates modes by dynamic time‐average interferometric holography can be used to detect some types of material defects. Representative results of a feasibility study, which dramatically demonstrate the potential of the method for nondestructive inspection of the bonds between boron‐epoxy prepreg material and aluminum substrates, are presented. In particular, it is shown that an area of less than 1 cm2 can be easily identified with an excitation frequency on the order of 20–40 KHz.