Design of a full band, compact waveguide-microstrip power splitter using multilayer PCB technology
Design of a full band, compact waveguide-microstrip power splitter using multilayer PCB technology
复制标题
采用多层PCB技术的全频段紧凑型波导微带功率分配器的设计
DOI：
10.1109/rfit.2009.5383713
复制
发表时间：
2009
期刊：
影响因子：
--
通讯作者：
Y. Leong
中科院分区：
文献类型：
--
作者：
H. Lim;Zhicheng Wei;Zhu Li;G. Ng;Y. Leong
本文给出了一种新型双探头结构的仿真结果，该结构采用多层PCB技术，能够在整个w波段从75 GHz到110 GHz频段进行功率分割。将现有的单探针波导到微带的过渡设计用于新的多层双探针结构，证明了该结构在波导到微带的过渡和功率分裂方面是有效的。新的一体式多层双探头结构将提供易于组装，提高一致性和降低制造成本。仿真结果表明，波导端口在整个w波段的回波损耗大于10 dB，插入损耗小于0.5 dB。
This paper presents the simulation results for a new dual-probe structure using multilayer PCB technology that is capable of performing power splitting across the whole of w-band frequency band from 75 GHz to 110 GHz. Existing single probe waveguide-to-microstrip transition design was employed for the new multilayered dual-probe structure, which proved to be effective in waveguide-to-microstip transition and power splitting. The new one piece multilayered dual-probe structure will provide ease in assembly, improve consistency and lower the manufacturing cost. Simulation results show that the return loss of the waveguide port to be greater than 10 dB and insertion loss better than 0.5 dB across whole w-band.