Analysis of silicon on-chip integrated antennas for intra- and inter-chip wireless interconnects
Analysis of silicon on-chip integrated antennas for intra- and inter-chip wireless interconnects
复制标题
用于片内和片间无线互连的硅片集成天线分析
DOI：
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发表时间：
2010
期刊：
影响因子：
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通讯作者：
S. Kubota
中科院分区：
文献类型：
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作者：
Takamaro Kikkawa;K. Kimoto;S. Kubota
硅芯片上集成天线已经被开发用于芯片内和芯片间的信号传输。然而，由于硅衬底的导电损耗，天线的辐射效率和传输增益降低。为了解决这些问题，研制了一种由高介电常数衬底构成的旁路平面波导，以降低通过Si芯片的传播损耗。本文研究了介质波导的介电常数和厚度对集成天线辐射效率和传输增益的影响。
Silicon on-chip integrated antennas have been developed for intra- and inter-chip signal transmission. However, the radiation efficiency and transmission gain of the antenna were degraded due to conductive loss of Si substrates. In order to solve these problems, a bypass planar wave guide which was composed of a high dielectric constant substrate was developed to reduce the propagation loss through Si chips. In this paper the effects of dielectric constant and thickness of the dielectric wave guide on radiation efficiency and transmission gain of integrated antenna are investigated.