Fivefold annealing twin in nanocrystalline Cu
Fivefold annealing twin in nanocrystalline Cu
复制标题
纳米晶铜中的五重退火孪晶
DOI：
10.1063/1.3263948
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发表时间：
2009-11-16
影响因子：
4
通讯作者：
Li, Y. H.
中科院分区：
文献类型：
--
作者：
Huang, P.;Dai, G. Q.;Li, Y. H.
在纳米晶Cu中观察到了零应力下的五重退火孪晶。用透射电子显微镜详细观察了不同退火温度下多重孪晶的显微结构。与已知的顺序孪晶机制相反，通过晶界段迁移形成的共格孪晶界被认为是五重退火孪晶的主要机制，它与退火过程中的晶粒生长有关。此外，还讨论了该机制在形成五重形变孪晶中起作用的可能性。
Fivefold annealing twin has been observed in nanocrystalline Cu at zero external stress. The microstructure of the multifold twins at various annealing temperatures has been examined by transmission electron microscopic in detail. Contrary to the well known sequential twinning mechanism, coherent twin boundaries formed via migration of grain boundary segment were proposed to be the dominant mechanism of fivefold annealing twin, which associated with grain growth during annealing. Moreover, the possibilities of the proposed mechanism may operate in forming fivefold deformation twin were discussed.