Influencing FTO thin film growth with thin seeding layers: a route to microstructural modification
Influencing FTO thin film growth with thin seeding layers: a route to microstructural modification
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DOI：
10.1039/c5tc02144h
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发表时间：
2015-01-01
影响因子：
6.4
通讯作者：
Parkin, Ivan P.
中科院分区：
文献类型：
--
作者：
Noor, Nuruzzaman;Chew, Clair K. T.;Parkin, Ivan P.
报道了一种新型的两步化学气相沉积（CVD）法在浮法玻璃上生长掺氟氧化锡（FTO）多晶透明导电氧化物（TCO）薄膜。气溶胶辅助CVD（AACVD）用于生长种子层以经由大气压CVD（APCVD）覆盖来引导和促进全膜生长。该方法允许在相对低的生长温度（500摄氏度）下对形态和更致密、更粗糙、更高性能的TCO进行可再现的控制。生长促进依赖于播种时间与最佳播种时间存在，低于形态控制和保形覆盖不可用。通过SEM、AFM、XRD、XPS、UV-Vis-Near IR透射-反射率和霍尔效应探针等测试手段对薄膜的性能和功能特性进行了表征。与商业材料相当并且具有高粗糙度和低透射雾度值的高度透明和导电的膜表明该方法产生具有可控形态的高质量膜，该可控形态可以根据所需应用进行调整。该多功能方法提供了一种实现具有高光学透明度和低发射率特性的高质量FTO薄膜的形态控制的途径，并且可以容易地扩展到各种不同的基底和金属氧化物材料。
We report on the seeded growth of fluorine doped tin oxide (FTO) polycrystalline transparent conducting oxide (TCO) thin films on float glass using a novel two-step chemical vapour deposition (CVD) method. Aerosol-assisted CVD (AACVD) was used to grow a seed layer to direct and promote full film growth via an atmospheric pressure CVD (APCVD) overlay. The method allowed for reproducible control over morphology and denser, rougher, higher-performing TCO at a relatively low growth temperature (500 degrees C). Growth promotion depended on seeding time with an optimal seeding time being present, below which morphology control and conformal coverage was unavailable. The film properties and functional characteristics were characterised by SEM, AFM, XRD, XPS, UV-Vis-Near IR transmittance-reflectance and Hall Effect probe measurements. Highly transparent and electrically conductive films, comparable to commercial materials and with high roughness and low transmission haze values indicate the process yields high quality films with a controllable morphology that can be tuned to desired application. The versatile method provides a route towards the morphological control of high-quality FTO thin films with high optical clarity and low-emissivity properties and can be readily extended to a variety of different substrates and metal oxide materials.