Numerical analysis of the influence of the Lode parameter on void growth
Numerical analysis of the influence of the Lode parameter on void growth
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DOI：
10.1016/s0020-7683(00)00391-7
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发表时间：
2001-08
影响因子：
3.6
通讯作者：
K.S Zhang;J.B Bai;D. François
中科院分区：
文献类型：
--
作者：
K.S Zhang;J.B Bai;D. François
本文对立方体单元内含球形空洞的有限变形问题进行了三维数值分析。计算中考虑了不同的应力三轴性，包括常用的三轴性参数和Lode参数。重点分析了不同Lode参数值对孔洞定向膨胀的影响。分析表明：(1)孔洞在不同方向上的膨胀速率随Lode参数的变化而不同；(2)Lode参数的变化改变了立方晶胞内孔洞不稳定膨胀(或孔洞连接)的临界应变。
In the present paper, three-dimensional numerical analyses of a spherical void, contained within a cubic cell, under finite deformation have been carried out. The calculations took the different stress triaxialities, including the common triaxiality parameter and the Lode parameter, into account. The analyses were focused on the influence of different Lode parameter values on the directional expansion of a void. According to the analyses, it can be concluded that: (1) the void has a different rate of expansion in different directions depending on the variation of the Lode parameter; (2) variation of the Lode parameter changes the critical strain of the void unstable expansion (or void linking) contained within the cubic cell.